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Onyx 3000
  • Micro-spot X-ray beam and pattern recognition
  • 2D- and 3D- optical characterization of device structures
  • High-throughput, blanket- and product-wafer measurements
  • Wide range of materials and applications
  • High resolution and precision covering thicknesses from Ångstroms to microns
  • Helium purged measurement environment for light-element sensitivity 
  • Configurable for 300mm and smaller wafers
  • Design based on SEMI S2 and SEMI S8

Hybrid XRF and Optical metrology FAB tool

300mm、200mmウェーハ上の各種薄膜の膜厚・組成を、同時に非破壊、非接触で分析可能な波長分散型蛍光X線分析装置(WD-XRF)

諸元/仕様

製品名 Onyx
手法 X-ray fluorescence and optical microscopy
用途 Measure ultra-thin single-layer films to multi-layer stacks; Characterize BEOL and WLP structures
テクノロジー Process micro-spot EDXRF and 2D-, 3D- optical microscopy
主要コンポーネント Design based on SEMI S2 and SEMI S8, micro-spot polycapillary X-ray optics
オプション SECS/GEM communication software, COLORS beam modules
制御(PC) 内部PC、MS Windows® OS
本体寸法 1390 (W) x 2040 (H) x 2960 (D) mm
質量 1250 kg (本体)
電源 単相 208 VAC 50/60 Hz, 16A